These chips are less advanced than those TSMC itself manufactures in Taiwan.
The larger size of the 300mn wafers enables the production of a higher number of chips.
Construction of the fab will begin in the second half of 2024, with initial production set for 2027.
The two companies expect an output of 55,000 wafers per month in 2029.
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NXP will hold 40% equity, backing the project with $1.6bn (1.5bn).
The remaining funding will come from (unspecified) third parties.
Taiwan is one of them, making approximately90%of the worlds most advanced chips.
For its part, Chinadominatesthe market of lower-end semiconductors.
Story byIoanna Lykiardopoulou
Ioanna is a writer at TNW.
With a background in the humanities, she has a soft spot for social impact-enabling technologies.
