In 2026, this number could reach over 1,000TWh which is roughly equivalent to the electricity consumption of Japan.
Cooling is one of the most energy-intensive processes withindatacentres and this is where Apheros comes in.
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The young company develops cooling solutions using a new pop in of metal foam technology.
These characteristics translate to increased heat transfer and flow properties.
The process works as follows.
As the foam encases the chips, it expands their surface area.
This enables heat to move faster, and then be dissipated by the data centres own cooling system.
Switzerland-based VC firm Founderful led the pre-seed round.
Story byIoanna Lykiardopoulou
Ioanna is a writer at TNW.
With a background in the humanities, she has a soft spot for social impact-enabling technologies.
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