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ESMC will deliver high-performance chips, based on 300mm silicon wafers with node sizes covering 28/22nm and 16/12nm.
Expected to reach full operational capacity by 2029, the fab will produce 480,000 silicon wafers per year.
It will provide semiconductors for automotive and industrial applications.
Alongside TSMC, Intel has also committed to build a30bn mega fabin Germany for highly-advanced chips.
Story byIoanna Lykiardopoulou
Ioanna is a writer at TNW.
With a background in the humanities, she has a soft spot for social impact-enabling technologies.
